Wafer Grinding, Lapping & Polishing

CAE has broad access to semiconductor related equipment direct from fabs, often unavailable through other sources. CAE finds the best deals on used wafer grinding, lapping & polishing. CAE has 2357 wafer grinding, lapping & polishing currently available for sale from a number of respected OEMs, including SPEEDFAM, DISCO, OKAMOTO and many others. You can choose from a selection of manufacturers and models, such as ACCRETECH / TSK W-GM-4200B, AMAT / APPLIED MATERIALS Mirra Mesa or DAITRON WBM-210. We’re accountable for every transaction — CAE will seek to collect as much information as you require to ensure that you receive the equipment in the condition that you are expecting. Send us your request to buy a used wafer grinding, lapping & polishing and we will contact you with matches available for sale.
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