Wafer Grinding, Lapping & Polishing - CINCINNATI

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5 結果が見つかりました: 中古 Wafer Grinding, Lapping & Polishing - CINCINNATI

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  • Photo CINCINNATI  D4

    CINCINNATI : D4

    Universal tool grinder Grinding spindle motor: 2 x 1 kW.
  • Photo CINCINNATI 2

    CINCINNATI: 2

    Tool and cutter grinder Area of table: 36"x5.25" Swing over table: 10" Length between workhead and c...
  • Photo CINCINNATI 2MT

    CINCINNATI: 2MT

    Tool and cutter grinder Area of table: 36"x6" Swing over table: 10" Grinding wheel speeds: 2958-3837...
  • Photo CINCINNATI 2

    CINCINNATI: 2

    Tool and cutter grinder Area of table: 36"x5.25" Swing over table: 10" Maximum center distance: 27" ...
  • Photo CINCINNATI 325-12

    CINCINNATI: 325-12

    Centerless grinder Max diamater: 6" Wide wheel: 12" Profile truing Infeed Compensation 1972 vintage.
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