中古 ALLWIN21 AW 2001R #9201803 を販売中

Plasma etcher, 2"-6" Wafer loading: 3-Axis robot Plasma power: Microwave Type: Parallel / Single wafer process Stand alone Gas lines: (4) Lines Applications: BPSG Etcher LTO Etcher TEOS Etcher Thermal oxide etcher LPCVD Nitride etcher PECVD Nitride etcher Trench rounding Descum RIE Damage removal Sodium removal Planarization Backside etcher: Poly, nitride, oxide Nitride pattern removal: PBL, LOCOS With pad oxide: >400Å Low temp photoresist ashing over: Oxides, Poly, Al, W, Ti Main frame with breakers, relays and wires Pentium class PC Keyboard Mouse USS SW Backup and cables Fixed cassette stations: (2) Cassette stations One cassette station / One centering / Alignment station Door assembly Metal shower head Extended alumina plasma tube for better uniformity Orifice, gas cap Chamber body and top plate Main control, distributor PCB and DC H1-7 x 10.5 Integrated (3) Axis solid robot Water cooled MAGNETRON and wave guide Water cooled 1000W MAGNETRON / Wave guide with an AGL Microwave power generator: 2.45GHz (4) Isolated gas lines With pneumatic valves and MFC AC Box Main & slow vacuum valves MKS Baratron Throttle valve Front EMO Interlocks Touch screen GUI, 15" Options: GEM / SECS II Function Light tower Vacuum pump Chuck temperature: 60-110ºC (±2 ºC) Gases: NF3, CF4, HE, O2 Uniformity: 100 mm: ± 3% (5% 3 σ) 150 mm: ± 5% (8% 3 σ) Maximum - minimum / 2 x average Reproducibility (w-t-w): 10% 3 σ Particulate: 0.05p / cm2 > 0.3µm Vacuum chamber pump: 165 cfm Cabinet exhaust: >250 cfm Plumbed gases: CF4 O2 He NF3 Electrical requirements: 208 VAC, 3 Phase, 6 Hz, 30 Amps.