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969 結果が見つかりました: 中古 Die Attachers

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  • PANDUIT CORPORATION: CP 851

    Stamper numatic press.
  • MRSI 170

    MRSI: 170

    Automatic dispensing system.
  • ESEC: 2005 LOC D-711

    Automatic epoxy die bonder parts system (2) wafer cartridge carriers (10) boxes of leadframes Control box is missing Does not include manuals or additional accessories As-is.
  • NEC / CANON: DBII

    LOC bonders, 1998 vintage.
  • MECH-EL: 827

    Hybrid ball bonder with B&L scope.
  • ESEC: 2007 BGA

    Die bonder, DINP-BH, PD, IQC, DBH, BFU, WMP, MH-BH.
  • HUGHES: 2500

    Epoxy Die Bonder, parts machine.
  • ESEC IP 2007 IC8 MATRIX

    ESEC: IP 2007 IC8 MATRIX

    Die bonders, 8" Stack-Magazine (Input-Output) Lead Frame Marking Unit Pre- and Post- Bond Inspection Option: Wafer mapping Hardware Configuration: Pick and place Wafer handler Indexer Top stack loader Output magazine handler Leadframe marking unit Prebond / Postbond inspection Wafer mapping connectivity Technical Specification: Leadframe thickness: 0.1-0.4mm Leadframe width: 9-75mm Leadframe length: 120-260mm Multichip (range in X): Max 42mm 2000 vintage.
  • TORAY FS 1000

    TORAY: FS 1000

    Fully automatic IC bonder for COF Currently under vacuum packing 2001 vintage.
  • LAURIER: 228

    (2) die bonders.
  • SEC: 4400

    Hot gas rework station Non heated workholder.
  • ESEC: 2008 D168

    Die attacher.
  • HITACHI / RENESAS CM 700

    HITACHI / RENESAS: CM 700

    Die bonders Productivity UPH; Max 3,000 [Process dependent] Placement Accuracy X, Y; <±38um (3σ) Software version: 01.076/01 Material applicable: Leadflame/substrate Width: 25 to 95mm, Length : 130 to 260mm Wafer 300mm, 200mm (Option) Die X, Y: 3×3 mm to 25×25 mm Magazine to Magazine and Stack to Magazine Bond Method Face down, Heat compression Bond tool Temperature up to 400℃ Bond force 7.8 to 147N (0.8 to 15 kgf) Lamionation tool temp. up to 400℃ Lamination force 19.6 to 588N (2 to 60 kgf) Pre-bake oven up to 300℃ Wafer Tape Expansion 2 to 20mm; (Programmable) [wafer tape dependent] Image Processing Grey scale pattern matching Utility requirement: Power AC200~240V, Single phase, 50A Air 0.4MPa, min. N2 0.3 to 0.5Mpa, 50 l/min Vacuum -75kPa to -85kPa Exhaust Flow rate : 300 l/min Axes: Loader/unloader motion Index track motion Die transfer motion Wafer transfer montion Wafer table movement 1st mount head /stage 2nd mount head /stage 1st bond force 2nd bond force Appearance: Light tower Monitor Case / spare parts Pre-bake (width:74mm) Pre-heat Wafer table 8 / 12 " Wafer cassette base ( 3 pin) Bearing/slider No Rubber tip holder 2.7x2.7 Mapping system: Notebook Rock key No Mapping software CD Floppy disk Barcode reader Operation & maintenance documents / machine function testing report 2001 vintage.
  • ALPHASEM SWISSLINE 9000

    ALPHASEM: SWISSLINE 9000

    Die Sorting machine, 1993 vintage.
  • ESEC 2007 BGA

    ESEC: 2007 BGA

    Die bonders (2) type D-138 (2) type D-139.
  • ESEC: BU 050N

    Unloader (2) Automatic die attachers.
  • HUGHES 2900-2

    HUGHES: 2900-2

    Tab Bonder, automatic, 1980-1990 vintage.
  • LAURIER HA-250

    LAURIER: HA-250

    Semiautomatic epoxy die bonder Software Revision: 2.18, Dec 1994 Power rating: 120V, 60Hz, 6A.
  • MECH-EL: 702

    epoxy die attachers.
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