中古 RUDOLPH WS 3840 #9136132 を販売中

Bump inspection system, 12" Granite base air bearing XY stages Vacuum chuck with rotation for 5", 6", 8" and 12" wafers Z Slide for focus control and wafer loading / Unloading OLYMPUS Optical head with 5 positions auto lens turret Bright field lighting Low angle dark field lighting Objective lenses: 1.25x, 2.5x, 5x and 10x 4K TDI Line scan camera & electronics Image frame grabber Dual quad core XENON processor PC based 2D vision engine Computer with 3.2GHz P4 processor RAM: 1GB Hard disk: 250 GB (2) Hot swap bays CDRW / DVDRW Operating system: Window XP Console arm with (2) flat panel color monitors Keyboard and mouse (4) Positions light tower Data analysis and reporting Color defect review Mini-environment fan / Filter units (ISO Class 2) Electronic wafer maps (KLAINF, EF, WWW, Semi G85 and SECS S12) 721713 Option Xport Wafer scanner ISO Class 1 clean high speed wafer handling EFEM outfitted With dual arm robot Wafer thicknesses: (725um) Down to 400 microns thickness for 12" wafers Down to 190 microns thickness for 8" wafers Automated whole wafer handling Dual arm vacuum assist backside wafer handling Minimal contact end effector Integrated laminar clean air flow mini-environment (ULPA Filtration) Robot with integrated mapper 721753 2 Option Bridge load port BROOKS Vision / Cassette pivot, 8" XENON Dual quad processor 2D vision engine 72054 1 Option, 3D Inspection, Hi Res 3D Sensor High resolution: 4 MHz 3D Sensor scans up to a .6mm swath Depth of field: 200um 1U Rack mount chassis Dual INTEL quad-core XENON processor 2.5 GHz DRAM: 2GB SATA Hard disk drive: 250 GB CD ROM Drive Ethernet RUDOLPH PCIDSP Board (5) Microns ultra high resolution 3D sensor 716983 1 Standard, 3D Height Verif Wafer, 100um, 300mm 716810 1 Option, Dual OCR X Port 66807 1 Computer, Remote defect review Wafer capability, 8"-12" Ultra flat chuck: <5 Microns chuck 2010 vintage.