中古 ISIS SENTRONICS SemDex A32-34 #9407579 を販売中

Wafer testing and metrology system, 8"-12" Automatic loading (2) Load ports (12" FOUB and 8" Open cassette via 12" Mechanical adaptor) Measurement part: Automated measurement: Substrate / Layer / Total thickness Bow / Warp Mini-bumps / Vias (Micro 3D metrology) and nm roughness Integrated sensor heads: Layer thickness / Bow: StraDex f2 - 80 (Top), StraDex f24 - 300 (Bottom) 3D micro-topography: StraDex a3 (Top, off-center by about 90 mm) Camera function (Top sensor) Autofocus: StraDex a3 (Precision mechanical bearing) StraDex f2 - 80 StraDex f24 - 300 (Air bearing) Anti-vibration plate below chuck Optical wavelengths: Top sensor: 830 nm (Minimum Silicon thickness 2.5 μm) Bottom sensor: 1300 nm (Minimum Silicon thickness 7 μm) Top sensor (Off-center): ~ 500 nm Integrated calibration samples: Thickness sample silicon: 123 μm (Roughness in the several nm level) Thickness sample silicon: 750 μm (Roughness in the several nm level) Step profiles for 3D Micro topography Cross hair for top and bottom thickness sensor alignment Sensor system with (3) StraDex sensor heads (Triple sensor setup): StraDex f2 - 80 (Top): Spot size: 8 μm Autofocus range: 2 - 22 mm Maximum warp: 3 mm Acquisition rate: < 4 kHz Thickness (Undoped silicon): Fast mode: 2.5 - 80 μm Slow mode: 2.5 - 80 μm Thickness (Glass, polymer): Fast mode: 5 - 200 μm Slow mode: 5 - 200 μm StraDex f24 - 300 (Bottom): Spot size: 24 μm Autofocus range: 24 - 44 mm Maximum warp: 2 mm Acquisition rate: < 4 kHz Thickness (Silicon): Fast mode: 8 - 350 μm Slow mode: 8 - 800 μm Thickness (Glass, polymer): Fast mode: 14 - 300 μm Slow mode: 14 - 1000 μm StraDex a3 (Top): Field-of-view: (0.35 mm)² Lateral pixel size: 0.3 μm Working distance: 3.5 mm Autofocus range: 4 mm Maximum Z-height: 60 μm (High-res.) / 120 μm (Low-res.) Repeatability: 0.5 nm (High-res.) Total acquisition time: 2 - 3 sec. Maximum focusing speed: 200 μm/s Surface roughness: Rz < 0.1 μm Confidence range: 2 Sigma Single sensor mode: Absolute accuracy: < ± 0.5 μm Repeatability (Fast mode): < ± 0.1 μm Repeatability (Slow mode): < ± 0.5 μm Twin sensor (Layer thickness) mode: Absolute accuracy: < ± 1 μm Repeatability (Fast and slow mode): < ± 0.5 μm Stage: Maximum X/Y travel range: 300 x 300 mm² Maximum velocity: 30 mm/s Lateral accuracy: 4 μm Maximum height variation repeatable: 2 μm Free positioning via keypads Anti-vibration table Air suspension Perforated vacuum chuck for double side measurements of 6", 8" and 12" unframed and framed wafers 10 mm Holes at 20 mm inter-center spacing Vacuum for wafer suction 3 Lift pins to elevate the wafer (≥ 200 mm in diameter) by 9.5 mm Wafer handling: Up to 60 wafers / hour Single ATM robot with vacuum gripper Pre-aligner OCR reader (Standard: Top scribe readout) General: Industrial computer (2 GHz) with screen Data interface: LAN Fan filter unit, ISO class 10 Temperature: 10°C - 35°C Power supply voltage: 100 V - 240 V, 50-60 Hz Maximum power consumption: 5 kW Sensor missing 2011 vintage.