中古 DNS / DAINIPPON 629 #9272101 を販売中

Coater / Developer system, 6" Specifications: Variety: Coater Loader / Unloader Step motor driving system Individual unit control I/H Unit, 6" Material of wafer handling arm: SUS304 (Modified) Wafer loading method: Handling arm with vacuum Digital wafer sensor Step motor driving system Bake, 6" Bake type: HP+CP (H.M.D.S) Wafer loading method: Wire moving with cylinder Spin unit (Develop): Wafer size: 6" Develop type: Rotation spray with spin motor Chemical liquid discharge method: N2 Pressurization Wafer chuck size: 70 mm Spin cup: Upper: PolyPropylene resin, 8" Lower: PolyPropylene resin Nozzle type: Spray nozzle type Exhaust control system Spin cover: Transparent acrylic Spin motor RPM: Maximum 6000 RPM Waste liquid drain: Natural drain Wafer moving: Moving with step motor Spin unit (Coater): Wafer size: 6" Coating method: Rotation with spin motor (Maximum 6000 RPM) P/R Discharge method: Bellows pump Wafer chuck size: 70 mm Spin cup: Upper: PolyPropylene resin, 8" Lower: PolyPropylene resin 2 Nozzle type (1/8") / Track Exhaust control system: Manometer installed Spin cover: Transparent acrylic Spin motor RPM: Maximum 6000 RPM P.R Dispense (maximum): 20 cc / 1 Stock Waste liquid drain: Manual drain Wafer moving: Moving with step motor Bake: Wafer size: 6" Bake type: H.P 2-Stage Bake temperature (maximum): 250°C Wafer moving: Moving with cylinder Utility specifications: Main power: AC 110 V / 30 A / Single phase AC 220 V / 30 A / Single phase Air pressure: 4~5 Kg/Cm² N2 Pressure: 3~4 Kg/Cm² Vacuum pressure: 60~70 Cm Hg Spin exhaust: 100 mm (20 mm Hg) Bake exhaust: 70 mm (20 mm Hg) Variety: Develop Composition Loader I/H unit develop I/H Unit unloader Unit configurations: Loader / Unloader Wafer size: 6" Step motor driving Individual unit control I/H Unit: Wafer size: 6" Material of wafer handling arm: SUS304 (Modified) Wafer moving method: Arm with vacuum Digital wafer sensor Step motor driving Spin unit (Develop): Wafer size: 6" Develop method: Rotation spray with spin motor Chemical liquid discharge method: N2 Pressurization Wafer chuck size: 70 mm Spin cup: Upper: PolyPropylene resin, 8" Lower: PolyPropylene resin Nozzle type: Spray nozzle type Exhaust control system: Manometer installed Spin cover: Transparent acrylic Spin motor RPM: Maximum 6000 RPM Waste liquid drain: Natural drain Wafer moving method: Moving by step motor Utility specifications: Main power: AC 110 V / 30 A / Single Phase AC 220 V / 30 A / Single Phase Air pressure: 4~5 Kg / Cm² N2 Pressure: 3 ~ 4 Kg / Cm² Vacuum pressure: 60~70 Cm Hg Spin exhaust: 100 mm (20 mm Hg).