中古 TEST RESEARCH INC / TRI TR 7007 SII #293810213 を販売中

3D Solder Paste Inspection (SPI) system Board thickness: 0.5-5 mm Camera type: 4 MP Camera Optical Resolution: 10 µm or 15 µm Field of view: 20 x 20 mm, 30 x 30 mm Mechanical stage: X-Axis linear motor and scale with DSP-based motion controller XY Resolution: 0.5 µm Z Resolution: 1 µm Inspection speed: 10 μm: Up to 90 cm²/sec (14.0 in²/sec) 15 μm: Up to 200 cm²/sec (31.0 in²/sec) Inspection performance: Volume repeatability: < 1% on TRI certification target Height repeatability: <1% on TRI certification target, << 10% at 6 Effective depth of focus: ± 5 mm (± 0.20 in) Height resolution: 0.4 µm Height accuracy: 1.5 µm Maximum solder paste size: 12800 x 10240 µm at 10 µm Minimum solder paste size: 100 x 100 µm at 10 µm Minimum solder paste pitch: 100 µm Maximum height range: 600 µm, 550 µm Air requirement: 0.6 MPa (87 psi) Power supply: 200-240 V, Single phase, 50/60 Hz, 3 kVA.