中古 QUALECTRONICS ESV-3041 #101143 を販売中

AOI system, benchtop Comes with either one or two CCD color cameras The dual camera version uses two different resolutions (16mm and 8mm), so the ESV-304 can magnify small features when needed, yet speed through areas with larger components and pitches The ESV-304 can inspect for missing, reversed, upside down, skew, tombstone, billboard, body color, resistor color code, part labeling, and solder bridges The ESV-304 can be used for both SMT and through hole components Linear Scale for Accuracy: The ESV-304 uses Precision Linear Scales on both the X & Y-axis Repeatability is less than +/-0.001" Maximum driving speed is 27.6" per second Combine Flexibility with Speed: Use the dual camera system Inspect 0402's and 20 mil QFP's with the 8mm camera, and speed through the larger parts with the 16mm camera's large frame size Support Warped Boards: Warped, sagging, or thin boards can be easily supported mechanically to insure reliable inspection Minimize False Rejects: The ESV-304's Normalizing Correlated Process minimizes the number of false rejects caused by variations in image brightness between different machines Inspection of Solder Fillers: Solder fillers may be inspected, by using the patent-pending Coaxial Illumination Unit A half-mirror is used to direct light vertically to the solder location If a fillet is present, the light will be reflected laterally Otherwise, the applied light will reflect upward and pass through the half-mirror to the camera Inspection of Solder Bridges: The ESV-304's proprietary IC-pin checking method can detect even the smallest bridges It scans pixels between leads from toe to heel If a solder bridge is detected, it will shift left and right laterally to verify that it is a real bridge, in order to reduce false rejects 2004 vintage.