中古 TEIKOKU TAPING SYSTEM EXL2-1200CSF2-CE-DFR-LSR-V1 #9314894 を販売中

Laminator Heated center teflon coated table: Maximum 100°C (+/- 1°C) Equipped with (3) lift vacuum pins for wafer support Non-heated outer teflon coated table Heated soft Si roller (10 mm): Maximum 60°C (±3°C) Tape sagging / Broken sensor / Short tape feed detection Programmable lamination pressure / Speed CO2 Non-contact laser cut mounted digital XY table Wafer press unit secure wafer table prior lamination Real-time wafer protrusion sensor OC Placement sensor Wafer handling: 5-Axis robotic UNIVERSAL Micro bernoulli finger capable handle, 8"/12" (3 mm) Finger with optical sensor for wafer presence Load / Unload: (2) Load ports: OC, 8" / FOUP / FOSB, 12" Mapper unit (MAP F) Wafer alignment: (2) Non-contact laser sensor for accurate wafer centering and alignment Programmable wafer placement orientation: 0°C / 45°C Lamination: Programmable lamination pressure / Speed Auto adjustments of tape tension / Table temperature / Input pressure (2) PC Quick conversion tables with minimal heat: 40°C outer table Teflon coated for DFR Applications Inner table equipped with (3) vacuum lifted pins Heated soft Si roller temperature: Up to 60°C ± 3°C (10 mm) Heated teflon coated table temperature: Up to 100°C ± 1°C Cutting method: CO2 laser non-contact cutting installed XY digital table Programmable laser power and cutting speed suit different tape Cutting outline: Lamination cover full wafer backside with PET Programmable notch cut position cutting exact wafer circumference: 0°C / 45°C.