中古 EVG / EV GROUP 620 #9189243 を販売中

Double sided mask aligner, 2"-6" Top side microscope Bottom side microscope 500W Lamphouse: 365 / 405nm Wafer chuck, 5" Mask holder: 6"x6" Thickness: Mask aligner: 0.1 - 10 mm (Max 2 mm for bottom side alignment) Bond aligner: 0.1 - 3 mm for each wafer or substrate Max stack height: 4.5 mm Mask parameters: Size: Max 7" Thickness: < 6.35 mm Throughput: Up to 100 wafers/hour (Aligned) up to 130 wafers/hour (First print) Alignment: Range of alignment: X, Y ± 5mm Rotation: Theta ± 3° X, Y, Theta axis resolution: 0.1 µm Alignment accuracy: Mask aligner: Down to ± 0.5 µm for top side alignment Down to ± 1 µm for top to bottom side alignment Bond aligner: Down to ± 0.5 µm for glass / silicon Down to ± 1 µm for silicon / silicon Handling system: Three axis robot, 4"-6" Cassettes: Send Receive Reject Robot accuracy: ± 25 µm Accuracy of pre-alignment station: X: ±50µm Y: ±50µm Theta: ±0.09° Separation / Proximity adjustment: Separation: Max 1000 µm adjustable in 1 µm steps controlled by software / microprocessor Contact force: Mask and substrate for wedge compensation Mask aligner: Adjustable from 0.5 - 50N Bond aligner: Adjustable from 1 - 50N Printing resolution: (350 - 450 nm) • Vacuum contact: Down to 0.6 µm Soft contact: Down to 2.0 µm Hard contact: Down to 1.5 µm Proximity: Down to 3.0 at 20 µm gap Monitor / Camera: High resolution between CCD camera and TFT monitor Lamp house: Standard NUV: 350 - 450nm Standard lamp power for 350W, 500W or 1000W UV Light uniformity: 100mm: ± 2% 150mm: ± 4% Intensity: (Measured at 365nm) 350W: 15 - 20 mW / cm2 500W: 20 - 25 mW / cm2 1000W: 40 - 45 mW / cm2 Applied industry standards: NRTL Semi S2, S8 certified.