中古 TEL / TOKYO ELECTRON Telius SP 308QS #116765 を販売中

Deep trench silicon etchers (4) Chambers (SCCM) Load locker modules Capacitively coupled module chambers (SCCM) (5) Loader ports FOUP, 12" Dual frequency source: 40 MHz and 3.2 MHz (GEW3040 and NOVA50A) ESD Chuck Temperature control Aluminum alloy chamber Material: Aluminum alloy (A6061) Surface finishing: Hard sulfuric acid anodizing RF Application method: Upper RF to lower electrode Discharge method: SCCM Type Temperature control: Upper electrode: Temperature control by heater and cooling water Lower electrode: Temperature control by circulating coolant Side wall: Temperature control by heater Shield ring Pressure monitor Lower electrode: Ceramics electro static chuck Thermometer in lower electrode Wafer holding method: Electrostatic chuck (φ300) mechanism Focus ring: Qz Exhaust plate: Aluminum alloy with hard sulfuric acid anodizing Insulation ring: QUARTZ Cover / Aluminum alloy (A6061) with hard sulfuric acid anodizing Distance between electrodes: 30~35 mm Magnet: Intensity:170 G (center) Rotation: 20±1 RPM He B.P Unit: Cooling gas for wafer back Pressure switch: PCV (STEC) Number of line / Control range of pressure: (2) lines (Center / Edge): 0~7980 Pa (0~60 Torr) Leakage monitor Detection of valve open / Close: Valve on / Off sensor SE2000 Endpoint detection Window: Orifice (QUARTZ) Deposition shield: Material: QUARTZ Shutter: Plate: Aluminum alloy with hard sulfuric acid anodizing Air cylinder drive Final valve: Diaphragm type APC Manifold: Aluminum alloy with hard sulfuric acid anodizing Chemratz O-ring for chamber Ultimate vacuum: 0.0133 Pa (7.5 x 10-2 mTorr) / Less Leak back: 0.133 Pa/min (1 mTorr / min) / Less 2005-2007 vintage.