中古 KARL SUSS / MICROTEC SB 6 #9039822 を販売中

Substrate bonder, 4" Can be configured up to 6" Manual loading/unloading of previously aligned wafer in SUSS BA6 using the SUSS transport fixture Software: automatic process data recording Motorized Z axis Chamber door with flange for automatic lid, class 1 cleanroom compatible Overpressure in chamber to avoid contamination during load/unload Adaptation for hot chuck A-150 Transport plate A-150 for loading sledge Vacuum: Membrane pump: 30 l/min Turbo molecular pump: Varian V250D Pump time: <6 min from 1000 to 1x10-4 mbar in clean chamber Purge time: <1 min from 0 to 1 bar Hot chuck, SB6/W-150: High vacuum bond chuck from <50 to 550 ºC with resistive heater and active air cooling Hot chuck 150mm for fixture size A-150 Flatness 20 µm at 500 ºC Temperature control +/- 5 deg, programmable temperature ramps Temperature uniformity +/- 3% Heating time 130-400 ºC 12 min Cooling time 400-200 ºC 14 min. Sandwich plate for hot chuck, SB6/W-100/A-150/90º Universal bond tool, SB6II/P/E-AREA-C2/HEAT/W-150: anodic and thermo-compression-bonding of wafers W-100-150 and chips S-40-100, stack thickness 0,4mm-6mm Spring loaded center bend pin: 20-50N, for keeping high alignment accuracy during heat-up Heater: up to 500ºC Pressure plate F. Uni tool, SB6/SST/W-100/A-150/P-8 Anodic bond controller: 2KV/ 10 mA: programmable voltage, polarity, current limit 2001 vintage.