中古 JFP MICROTECHNIC WB200 #9217427 を販売中

Semiautomatic wire bonder Ball, wedge & bump Table top machine Bond arm length: 165 mm (6.7") Deep-access bond head Motorized Z bond head: True vertical motion: Z Travel: 40 mm Z Accuracy: 1 µm Motorized: X & Y: 50 x 50 mm X & Y Accuracy: 2 µm Ultrasonic power: 0-2 W / 0-10 W Transducer: WBT140: 62 kHz, 185 mm Long Mouse motion drive Motorized up-down clamp Automatic motorized wire spool, 2" Electronic flame-off Missing ball detection Touch screen interface: 7" Simatic Storage: 50 Programs Programs storage, unlimited on USB Stick Temperature controller integrated Bonding modes: Semi-auto with binocular Full manual Z control with binocular Auto-bond cycle with vertical camera multi-height focus Parameters: Digital programming Programmable bond force I and II: 15-100 cNm Programmable time I and II: 15-5000 msec Programmable power I and II Loop: Reverse + height + length Programmable multi-shape loop per wire Bond: Search height programmable Automatic bond height detection Programmable tail length Wire termination: Table tear / Clamp tear Wedge deep access: 90° Wire feeding Multiple wires: Chain Wire capability: Gold wire: 17-50 µm Aluminium wire: 17-50 µm Ribbon wire: 40-200 µm width (12-25 µm Thick) Heater stage: HP 60-250 X T° Accuracy: +/- 1% Adjustable height Working height: 100 mm Technical data: Ultrasonic system: PLL, 62 kHz Capillary tool: 1,58 mm (1/16") Diameter Current: Maximum 5 A Power: 100 / 240 V, 50-60 Hz.