中古 ASM MCM12 #9137827 を販売中

Multi-Chip mounting machine, 12" Substrate type: BGA, boat, ceramic, flex substrate, FR4, leadframe, wafer Direct die bonding High precision die bonding Flux dispensing / dipping flip chip bonding SMD bonding Wafer to wafer bonding Thin die bonding XY placement: +/-25um @3 sigma (Die bond) Die rotation: +/- deg @3 sigma (Die bond) Die size: 0.15x0.15 to 50*50mm (Die bond) Wafer: Die size (Die attach): 0.15 to 50mm Die size (Flip-chip): 0.8 to 50mm Die thickness: 0.1 to 5mm Chip tray: Waffle pak gel pak: 2" 3" & 4" Die thickness: 0.1 to 5mm Process material handler: Dispenser: Type: Time-Pressure, Auger pump Cartridge size: 5cc, lOcc, & 30cc Filling level control: Sensor Slide Fluxer: Flux film thickness: 20 to 150 µm Flux film evenness: ±3 µm Viscosity range: 2,800 to 110,000 cps (6) Tool changer Component handler: Bond-Head: Die attach bond arm Bond force: Up to 400gf (3kg with Cylinder) Bond force Control : Voice coil + Cylinder + Micro-E encoder Pick force: 30 to 400gf Z-Travel: BH 110mm; EW 30mm Rotation: ±180° Rotation resolution : 0.022° Rotation repeatability: ±0 06° Flip-Chip unit: Pick force: 50 to 300gf Z-Travel: 5mm Resolution: 0.2 µm Rotation: 180° Wafer table Standard Option XY Travel 320 X 320mm 320 X 320mm Expansion Programmable Zero, 5mm, 10mm Max 15mm Rotation 360° Nil Conversion <10 min <10 min Configured to work with magazines.