中古 ASM Eagle 60 #9288232 を販売中

Wire bonder Ambient temperature: 5°C - 40°C Humidity: <80% Bonding method: THERMOSONIC (TS) BQM Mode: Constant current Voltage Power and normal Loop type: Normal, low, square, penta and J X, Y Resolution: 0.2 µm Z Resolution (Capillary travelling motion): 0.4 µm Fine pitch capability: 35 µm Pitch at 0.6 mil wire Bonding wires: Up to 3000 Program storage: 1000 Programs on hard disk Multimode transducer system: Control and vibration modes Vision system: Pattern recognition time: 60 ms / Point Pattern recognition accuracy: ±0.37 µm Lead locator detection: 12 ms / Lead (3 Leads / Frame) Lead locator accuracy: ±2.4 urn Maximum die level different: 400-500 µm Material handling system: Indexing speed: 200-250 ms at 0.5" Pitch Indexer resolution: 1 µm Lead frame position accuracy: ±2 Mil Lead frame: Width: 24-73 mm at Bonding area in Y: 65 mm 24-90 mm at Bonding area in Y: 48 mm Maximum length: 280 mm T: 0.075-0.8 mm Applicable magazine: Maximum width: 98 mm Length: 140-280 mm Maximum height: 180 mm Magazine pitch: 2.4-10 mm (0.09" - 0.39") Device changeover: <4 minutes Package changeover: <5 minutes (3) Buffer magazines: 435 mm (maximum) Power supply: Compressed air: 152 LPM Maximum at 3-6 bar Voltage: 110 VAC Voltage tolerance: +10% Frequency: 50 Hz Frequency tolerance: ±1% Single phase Power consumption: 1500 W 2005 vintage.