中古 ASM Eagle 60 #9166797 を販売中

Wire bonder Interface: ASM Application: SOIC Package Power requirement: 220VAC, 1 Phase Bonding system: Bonding method THERMOSONIC (TS) BQM Mode: Constant current, voltage, power and normal (Programmable) Loop type: Normal, low, square, penta, J, VLED, FLEX XY Resolution: 0.2 μm Z Resolution (Capillary travelling motion): 0.4 μm Fine pitch capability: 35 μm pitch @ 0.6 mil wire (3000) Bonding wires Program storage: 1000 Programs on hard disk Multi mode transducer system: Programmable profile Control / Vibration modes Vision system: Pattern recognition time: 60 ms / point Pattern recognition accuracy: + 0.37 μm Lead locator detection: 12 ms / lead (3 leads/frame) Lead locator accuracy: + 2.4 μm Post bond inspection: First bond, second bond / Wire tracing Maximum die level different: 400 – 500 μm Material handling system: Indexing speed: 200 – 250 ms @ 0.5" pitch Indexer resolution: 1μm Lead frame position accuracy: + 2 mil Applicable lead frame: W: 24 - 73 mm @ bonding area in Y = 65 mm 24 - 90 mm @ bonding area in Y = 48 mm L: 280 mm (Maximum) T: 0.075 - 0.8 mm Applicable magazine: W: 98 mm (Maximum) L: 140 - 280 mm H: 180 mm (Maximum) Magazine pitch: 2.4 - 10 mm (0.09” - 0.39“) Device changeover: < 4 minutes Package changeover: < 5 minutes Number of buffer magazine: 3 (Maximum 435 mm) Facilities: Voltage: 110 VAC Voltage tolerance: ± 10 % Frequency: 50 Hz Frequency tolerance: ± 1 % Phase: Single Compressed air: 152 LPM maximum at 3 - 6 bar Power consumption: 1500 W Operating condition: Ambient temperature: 5 °C to 40 °C Humidity: < 80 % Attitude: 1000 m above sea level 2005 vintage.