中古 ASM Eagle 60 #146910 を販売中

Automatic wire bonders Can be converted to copper wire Bonding system: Bonding method: Thermosonic (TS) BQM mode: Constant current, voltage, power and normal (programmable) Loop type: Normal, low, square, penta, J, VLED, FLEX XY Resolution: 0.2 um Z Resolution (capillary traveling motion): 0.4 um Fine pitch capability: 35 um pitch at 0.6 mil wire (3000) Bonding wires Program storage: 1000 programs on hard disk Multimode transducer system: Programmable profile Control / Vibration modes Vision system: Pattern recognition time: 60 ms / point Pattern recognition accuracy: ± 0.37 µm Lead locator detection: 12 ms / lead (3 leads / frame) Lead locator accuracy: ± 2.4 µm Post bond inspection: First bond, second bond / Wire tracing Maximum die level different: 400 to 500 µm Material handling system: Indexing speed: 200 to 250 ms at 0.5" pitch Indexer resolution: 1 µm Lead frame positioning accuracy: ± 2 mil Applicable lead frame: W: 24 to 73 mm at bonding area in Y = 65 mm W: 24 to 90 mm at bonding area in Y = 48 mm L: 280 mm (maximum) T: 0.075 to 0.8 mm Applicable magazine: W: 98 mm (maximum) L: 140 to 280 mm H: 180 mm (maximum) Magazine pitch: 2.4 to 10 mm (0.09" to 0.39") Device changeover: Less than 4 minutes Package changeover: Less than 5 minutes Number of buffer magazines: 3, maximum 435 mm Facilities: Voltage: 110 VAC (100/120/200/210/220/230/240 VAC) Voltage tolerance: +/- 10% Frequency: 50 Hz (60 Hz optional) Frequency tolerance: +/- 1% Single phase Compressed air: 360 LPM maximum at 3 to 6 bar Power consumption: 1500 W Operating condition: Ambient temperature: 5°C to 40°C Humidity: <80% Altitude: 1000 m above sea level 2004 vintage.