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1134 results for found: 中古 Crystal Growing, Sawing & Slicing

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  • ACCRETECH / TSK: S-LM 116G

    ACCRETECH / TSK S-LM 116G Vertical Slicing Machine, high precision 220V, 60Hz, 2.2KvA, 0.5 MPa Max ingot size: 100mm diameter x 350mm long De-installed, can inspect 2000 vintage.
  • APEKS: 250

    APEKS 250 Sapphire growing furnace De-installed 2011 vintage.
  • APEKS: 250

    APEKS: 250 Sapphire growing furnace De-installed 2011 vintage.
  • APEKS: 250

    APEKS 250 Sapphire growing furnace De-installed 2011 vintage.
  • APEKS: 250

    APEKS 250 Sapphire growing furnace De-installed 2011 vintage.
  • APEKS: 250

    APEKS 250 Sapphire growing furnace De-installed 2011 vintage.
  • APPLIED MATERIALS: 500SD-B/5

    APPLIED MATERIALS 500SD-B/5 Wafer saw Cutting Speed Feed rate: 0-9000 µm/minute Max Travel: up to 290 mm Fast Table Speed: 0 - 500 mm/min Wire speed: 0 - 18 m/sec Wire Tension: 0 - 30N Slurry Tank Capacity: 550L Drive motors for web: 2x 61kW Average power consumption: 156 kVA Maximum power consumption: 287 kVA Maximum Working Capacity: 4 x 160mm blocks Maximum Block Size: 160mm W x 160mm H x 500mm Length, without split web for blocks up to 248mm equal length, 8 block capacity 2008 vintage.
  • APPLIED MATERIALS: 500SD-B/5

    APPLIED MATERIALS 500SD-B/5 Wafer saw Cutting Speed Feed rate: 0-9000 µm/minute Max Travel: up to 290 mm Fast Table Speed: 0 - 500 mm/min Wire speed: 0 - 18 m/sec Wire Tension: 0 - 30N Slurry Tank Capacity: 550L Drive motors for web: 2x 61kW Average power consumption: 156 kVA Maximum power consumption: 287 kVA Maximum Working Capacity: 4 x 160mm blocks Maximum Block Size: 160mm W x 160mm H x 500mm Length, without split web for blocks up to 248mm equal length, 8 block capacity 2008 vintage.
  • APPLIED MATERIALS: HCT

    APPLIED MATERIALS: HCT Ingot squarer Number of runs: 3152 2007 vintage.
  • APPLIED MATERIALS: HCT

    APPLIED MATERIALS HCT Ingot squarer Number of runs: 3152 2007 vintage.
  • APPLIED MATERIALS: 500SD-B/5

    APPLIED MATERIALS 500SD-B/5 Wafer saw Cutting Speed Feed rate: 0-9000 µm/minute Max Travel: up to 290 mm Fast Table Speed: 0 - 500 mm/min Wire speed: 0 - 18 m/sec Wire Tension: 0 - 30N Slurry Tank Capacity: 550L Drive motors for web: 2x 61kW Average power consumption: 156 kVA Maximum power consumption: 287 kVA Maximum Working Capacity: 4 x 160mm blocks Maximum Block Size: 160mm W x 160mm H x 500mm Length, without split web for blocks up to 248mm equal length, 8 block capacity 2008 vintage.
  • APPLIED MATERIALS: 500SD-B/5

    APPLIED MATERIALS 500SD-B/5 Wafer saw Cutting Speed Feed rate: 0-9000 µm/minute Max Travel: up to 290 mm Fast Table Speed: 0 - 500 mm/min Wire speed: 0 - 18 m/sec Wire Tension: 0 - 30N Slurry Tank Capacity: 550L Drive motors for web: 2x 61kW Average power consumption: 156 kVA Maximum power consumption: 287 kVA Maximum Working Capacity: 4 x 160mm blocks Maximum Block Size: 160mm W x 160mm H x 500mm Length, without split web for blocks up to 248mm equal length, 8 block capacity 2008 vintage.
  • APPLIED MATERIALS: 500SD-B/5

    APPLIED MATERIALS 500SD-B/5 Wafer saw Cutting Speed Feed rate: 0-9000 µm/minute Max Travel: up to 290 mm Fast Table Speed: 0 - 500 mm/min Wire speed: 0 - 18 m/sec Wire Tension: 0 - 30N Slurry Tank Capacity: 550L Drive motors for web: 2x 61kW Average power consumption: 156 kVA Maximum power consumption: 287 kVA Maximum Working Capacity: 4 x 160mm blocks Maximum Block Size: 160mm W x 160mm H x 500mm Length, without split web for blocks up to 248mm equal length, 8 block capacity 2008 vintage.
  • APPLIED MATERIALS: 500SD-B/5

    APPLIED MATERIALS 500SD-B/5 Wafer saw Average power consumption: 156 kVA Maximum power consumption: 287 kVA 2008 vintage.
  • APPLIED MATERIALS / HCT: E500SD-B/5

    APPLIED MATERIALS / HCT E500SD-B/5 Wire saws.
  • APPLIED MATERIALS / HCT: E500SD-B/5

    APPLIED MATERIALS / HCT E500SD-B/5 Wire saws Slices mono-crystalline silicon ingots and poly-crystalline silicon bricks Designed to slice photovoltaic cells Thin and ultra thin wafers (100 µm to 240 µm) Wafer size / Ingots per setup / Ingot length 125 mm x 125 mm / 4 / 500 mm 156 mm x 156 mm / 4 / 500 mm 210 mm x 210 mm / 2 / 500 mm Slurry recycling unit: Throughput 30 MW / system / yr Used slurry components: SiC Coolant (HS, oil, PEG.) Kerf (Si, fine SiC, Fe,.) Double stage recovery: Solid / Solid (SiC / Kerf) Solid / Liquid (Coolant / Kerf ) Accessories and spare parts: Loading and unloading devices Manual orientation systems (MOS) Gluing stations Optical alignment tools Specialized loading and unloading equipment Slurry Cutting wire.
  • APPLIED MATERIALS / HCT: 500SD-B/5

    APPLIED MATERIALS / HCT 500SD-B/5 Wire saws 2008-2009 vintage.
  • APPLIED MATERIALS / HCT: E500SD-B/5

    APPLIED MATERIALS / HCT E500SD-B/5 Wire saws Slices mono-crystalline silicon ingots and poly-crystalline silicon bricks Designed to slice photovoltaic cells Thin and ultra thin wafers (100 µm to 240 µm) Wafer size / Ingots per setup / Ingot length 125 mm x 125 mm / 4 / 500 mm 156 mm x 156 mm / 4 / 500 mm 210 mm x 210 mm / 2 / 500 mm Slurry recycling unit: Throughput 30 MW / system / yr Used slurry components: SiC Coolant (HS, oil, PEG.) Kerf (Si, fine SiC, Fe,.) Double stage recovery: Solid / Solid (SiC / Kerf) Solid / Liquid (Coolant / Kerf ) Accessories and spare parts: Loading and unloading devices Manual orientation systems (MOS) Gluing stations Optical alignment tools Specialized loading and unloading equipment Slurry Cutting wire.
  • APPLIED MATERIALS / HCT: E500SD-B/5

    APPLIED MATERIALS / HCT E500SD-B/5 Wire saws Slices mono-crystalline silicon ingots and poly-crystalline silicon bricks Designed to slice photovoltaic cells Thin and ultra thin wafers (100 µm to 240 µm) Wafer size / Ingots per setup / Ingot length 125 mm x 125 mm / 4 / 500 mm 156 mm x 156 mm / 4 / 500 mm 210 mm x 210 mm / 2 / 500 mm Slurry recycling unit: Throughput 30 MW / system / yr Used slurry components: SiC Coolant (HS, oil, PEG.) Kerf (Si, fine SiC, Fe,.) Double stage recovery: Solid / Solid (SiC / Kerf) Solid / Liquid (Coolant / Kerf ) Accessories and spare parts: Loading and unloading devices Manual orientation systems (MOS) Gluing stations Optical alignment tools Specialized loading and unloading equipment Slurry Cutting wire.
  • APPLIED MATERIALS / HCT: E500SD-B/5

    APPLIED MATERIALS / HCT E500SD-B/5 Wire saws Slices mono-crystalline silicon ingots and poly-crystalline silicon bricks Designed to slice photovoltaic cells Thin and ultra thin wafers (100 µm to 240 µm) Wafer size / Ingots per setup / Ingot length 125 mm x 125 mm / 4 / 500 mm 156 mm x 156 mm / 4 / 500 mm 210 mm x 210 mm / 2 / 500 mm Slurry recycling unit: Throughput 30 MW / system / yr Used slurry components: SiC Coolant (HS, oil, PEG.) Kerf (Si, fine SiC, Fe,.) Double stage recovery: Solid / Solid (SiC / Kerf) Solid / Liquid (Coolant / Kerf ) Accessories and spare parts: Loading and unloading devices Manual orientation systems (MOS) Gluing stations Optical alignment tools Specialized loading and unloading equipment Slurry Cutting wire.
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